ʻO ka Laser Ball Jetting Machine kahi mīkini no ka hoʻoheheʻe ʻana i ka laser sequential, e mālama ana i nā ʻano mea like ʻole microelectronic, i hoʻolaʻa ʻia no nā modula kamera, nā mea ʻike, nā mea ʻōlelo TWS a me nā mea uila.
Hiki i ka ʻōnaehana ke hoʻonohonoho a hoʻihoʻi hou i nā pōlele solder me ke anawaena ma waena o 300 µm a me 2000 µm, ʻo ka wikiwiki kūʻai ʻana ma kahi o 3 ~ 5 pōpō i kekona.
Hoʻopili ʻia i ka pōpō pōleʻa o nā huahana e like me Camera Modules, BGA re-balling, wafers, optoelectronic products, sensors, TWS speakers, FPC to rigid pcb…etc.